Solderless
Taiyosha suggest the best solutions for high temperature environments.
There are cases where electronic components used in in-vehicle products are mounted in high temperature environments that cannot be supported by solder mounting.In addition, the adoption of next-generation power semiconductors such as SiC and GaN is expected to increase in the future, and since these next-generation power semiconductors can work under high temperature environments, it is expected that peripheral components will be required to work under similar temperature environments. Taiyosha suggests special plated products for wire bonding or mounting with conductive adhesives, other than solder mounting and chip resistors that work with high power even in high temperature environments.
We suggest products that meet customer's demands.Please contact our sales department for details.
- Reference example
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- Wire-bonding joint products
- Gold plate products supported for conductive adhesives
Example of Φ300μm aluminum wire bonding
3216 Chip Resistor
Example of gold wire bonding
3216 Chip Resistor
Example of conductive adhesive bonding
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